Question 1

Fabrication and characterization of polarization doped ultrawide-bandgap semiconductor devices

Accepted Answer

This study aims to advance understanding of AlN, one of the most promising materials among ultrawide-bandgap semiconductors. One of AlN’s biggest issues is low carrier concentration in doped samples, especially low concentration of holes after p-type doping. The novel technique of distributed polarization doping of AlGaN will be used to overcome this issue in order to fabricate AlGaN-based semiconductor devices. The research will focus on optimizing the growth and characterization of Al(Ga)N layers, and on applying polarization doping in the design and fabrication of semiconductor power devices.

Aalto University

Question 2

Regrowth free monolithic integration platform on GaAs using vertical twin waveguides

Accepted Answer

This research focuses on developing a regrowth-free approach to monolithic active-passive photonic integration based on GaAs platforms utilizing vertical twin waveguide architecture. By leveraging selective oxidation of AlGaAs layers, the project aims to achieve efficient lateral optical and carrier confinement and facilitate high coupling efficiency between active and passive waveguides. This architecture eliminates regrowth interfaces and the challenges of oxidation in GaAs-based photonic integrated circuits (PICs), thus enabling high-performance operation and offers potential advantages in miniaturization and scalability.
Simulations predict over 98% coupling efficiency and robust Fabry-Perot laser performance, validating this approach for creating compact and efficient GaAs PICs. This technology holds significant promise for applications such as satellite-based lidar and free-space optical communications, expanding the operable wavelength range beyond traditional PIC platforms. By reducing fabrication complexity, it offers a pathway towards scalable, versatile photonic systems.

Aalto University

Question 3

Advanced Co-Design of Multi-Port Antennas and Integrated Circuits

Accepted Answer

This research explores a co-design methodology that integrates antennas and integrated circuits (ICs) into unified systems. By moving beyond the traditional independent design of components, this project investigates how multi-port antenna architectures can directly interface with various active circuits, such as amplifiers. The primary goal is to eliminate bulky intermediate components and optimize the entire system's footprint, signal integrity, and functionality. Initial work has demonstrated high-efficiency antenna-amplifier integration, and the project is now evolving toward more complex multi-port topologies and highly integrated hardware modules. The expected impact is a new method for the integration compact, high-performance RF systems.

Aalto University

Question 4

ASIC for power electronics

Accepted Answer

This doctoral research investigates the use of application-specific integrated circuits (ASICs) to improve the performance, reliability, and cost-efficiency of industrial power electronic systems. The primary aim is to reduce component count and enhance functionality by replacing discrete gate-driving solutions with integrated, programmable ASIC-based implementations. The work focuses on programmable current-source gate drivers and the intelligent gate driver concept for industrial frequency converters, enabling precise current control, adaptability to emerging power semiconductor technologies, and integration of advanced features such as condition monitoring and fault detection.

The expected results include the design and fabrication of two ASIC prototypes in a 130 nm BCD process, demonstrating improved gate-driving performance and system-level intelligence. The outcomes are expected to increase system reliability, flexibility, and scalability, with direct impact on industrial power electronics applications.

Aalto University

Question 5

Exploring the Potential of PECVD-Synthesized Carbon Nanofibers in Advanced Bioelectronic Interfaces

Accepted Answer

This PhD project focuses on optimizing the synthesis of carbon nanofibers (CNFs) via Plasma-Enhanced Chemical Vapor Deposition (PECVD) for use in advanced bioelectronic interfaces. It systematically examines how key PECVD parameters affect CNF morphology, alignment, surface chemistry, and, in turn, their electrochemical performance. The project aims to tailor CNFs to maximize overall electrochemical kinetics, mechanical flexibility, long-term stability, and biocompatibility. By establishing clear links between synthesis conditions, nanostructure, and material performance, it seeks to address the limitations of conventional interface materials. The anticipated outcome is a framework for the rational, data-driven design of CNF-based bioelectronic interfaces that are efficient, robust, and biologically compatible, enabling next-generation medical devices and sensing technologies.

Aalto University

Question 6

Cost-efficient NIR detectors on silicon substrate

Accepted Answer

This project aims to develop cost-efficient highly sensitive near-infrared (NIR) photodetectors integrated on silicon substrates using germanium as a functional layer. The main goal is to enable high device performance through scalable and industrially feasible approaches that reduce both optical (surface reflectance) and electrical (surface recombination and generation) losses. Target performance metrics include low surface recombination velocity and suppressed surface reflectance across the wavelengths up to 2 µm, resulting in high quantum efficiency of the photodetectors. Expected results include a validated device concept and fabrication route suitable for silicon-based platforms. The outcome is primarily expected to boost imaging capabilities (e.g. in CMOS/CCD cameras) but could also benefit other photonics and optoelectronics applications (LiDAR, PICs, etc).

Aalto University

Question 7

Advanced TFTs and circuitry based on low-temperature ALD

Accepted Answer

This PhD project develops high-performance thin-film transistors (TFTs) and circuits on flexible substrates using low-temperature atomic layer deposition (ALD) combined with high-density printing. The focus is on creating high-quality gate dielectrics through laser-assisted ALD, where in-situ laser pulses enhance film densification and crystallinity without additional high-temperature post-annealing. The key goal is to achieve excellent electrical performance at temperatures compatible with thermally sensitive substrates like polymers. Expected outcomes include a simplified, energy-efficient fabrication method, reduced process complexity, and improved compatibility with heat-sensitive materials. By enabling sustainable, low-cost manufacturing, this work supports next-generation flexible, wearable, and IoT electronics.

Tampere University

Question 8

Chip assembly and interconnections for soft electronic platform

Accepted Answer

This PhD research focuses on developing chip assembly and interconnection on soft elastomer platforms, using liquid metal as highly stretchable and strain-insensitive conductive traces. The work aims to implement bonding methods for assembling rigid electronic components, including surface mount devices and integrated circuit packages. Then, the reliability of these bonds and the overall stretchable electronic system is systematically investigated under mechanical deformation and varying environmental conditions. The expected outcome is to establish suitable bonding techniques and assembly processes that enable reliable, manufacturable, and long-lasting stretchable electronics. These advancements will support future applications in healthcare devices, wearable systems, soft robotics, and other emerging fields requiring highly stretchable, resilient electronic platforms.

University of Oulu

Question 9

Gradient index structures for sub-THz lens-antenna applications

Accepted Answer

This research aims to develop environmentally friendly dielectric composites for mmWave and sub-THz lens–antenna applications. The goal is to achieve spatial control of material permittivity to enable antireflection coatings, interlayers, and index-modulated two- and three-dimensional structures for efficient electromagnetic wave propagation. The work combines composite material development, 2D/3D electronic structure design, processing, characterization, and electromagnetic simulations to optimize material properties and structural designs compatible with antenna integration.

The expected outcomes include reduced reflection losses and enhanced beam collimation or steering, leading to antenna gain improvements of up to 10 dB and improved directionality. These advances will support reliable, low-latency high-frequency wireless systems and accelerate the integration of material-enabled refractive and diffractive components in next-generation (6G) communication technologies.

University of Oulu

Question 10

Semiconductor Device Modeling for Analog AI Accelerator

Accepted Answer

This research develops physics-based TCAD models for emerging ferroelectric devices FeCAPs, FeFETs, and FTJs, specifically tailored for analog AI accelerator applications. Using Synopsys Sentaurus and Landau-Khalatnikov dynamics, the work aims to accurately characterize polarization switching, retention, and domain structure effects in HfZrO₂-based ferroelectric systems. Key objectives include improving device reliability, energy efficiency, and scalability while validating models against experimental data.

The project bridges device physics with circuit-level integration, developing compact models suitable for analog AI circuit simulations. A novel Voronoi diagram-based approach represents realistic ferroelectric grain structures, replacing conventional idealized models. Expected impacts include enabling designers to leverage ferroelectric devices for ultra-low-power in-memory computing and neuromorphic applications, advancing next-generation AI hardware beyond conventional CMOS technology.

University of Oulu

MIELi

Doctoral school pilot for microelectronics in Finland

What is MIELi?

Microelectronics covers four interdependent technology layers:

MIELi Research Topics

Fabrication and characterization of polarization doped ultrawide-bandgap semiconductor devices

Regrowth free monolithic integration platform on GaAs using vertical twin waveguides

Advanced Co-Design of Multi-Port Antennas and Integrated Circuits

ASIC for power electronics

Exploring the Potential of PECVD-Synthesized Carbon Nanofibers in Advanced Bioelectronic Interfaces

Cost-efficient NIR detectors on silicon substrate

Advanced TFTs and circuitry based on low-temperature ALD

Chip assembly and interconnections for soft electronic platform

Gradient index structures for sub-THz lens-antenna applications

Semiconductor Device Modeling for Analog AI Accelerator

MIELi Mentoring Programme

The project has the following objectives:

MIELi Steering group:

MicroElectronics Finland

Fabrication and characterization of polarization doped ultrawide-bandgap semiconductor devices

Regrowth free monolithic integration platform on GaAs using vertical twin waveguides

Advanced Co-Design of Multi-Port Antennas and Integrated Circuits

ASIC for power electronics

Exploring the Potential of PECVD-Synthesized Carbon Nanofibers in Advanced Bioelectronic Interfaces

Cost-efficient NIR detectors on silicon substrate

Advanced TFTs and circuitry based on low-temperature ALD

Chip assembly and interconnections for soft electronic platform

Gradient index structures for sub-THz lens-antenna applications

Semiconductor Device Modeling for Analog AI Accelerator

MIELi

Doctoral school pilot for microelectronics in Finland

What is MIELi?

Microelectronics covers four interdependent technology layers:

MIELi Research Topics

Fabrication and characterization of polarization doped ultrawide-bandgap semiconductor devices

Regrowth free monolithic integration platform on GaAs using vertical twin waveguides

Advanced Co-Design of Multi-Port Antennas and Integrated Circuits

ASIC for power electronics

Exploring the Potential of PECVD-Synthesized Carbon Nanofibers in Advanced Bioelectronic Interfaces

Cost-efficient NIR detectors on silicon substrate

Advanced TFTs and circuitry based on low-temperature ALD

Chip assembly and interconnections for soft electronic platform

Gradient index structures for sub-THz lens-antenna applications

Semiconductor Device Modeling for Analog AI Accelerator

MIELi Mentoring Programme

​The project has the following objectives:

​​​​MIELi Steering group:

MicroElectronics Finland

Fabrication and characterization of polarization doped ultrawide-bandgap semiconductor devices

Regrowth free monolithic integration platform on GaAs using vertical twin waveguides

Advanced Co-Design of Multi-Port Antennas and Integrated Circuits

ASIC for power electronics

Exploring the Potential of PECVD-Synthesized Carbon Nanofibers in Advanced Bioelectronic Interfaces

Cost-efficient NIR detectors on silicon substrate

Advanced TFTs and circuitry based on low-temperature ALD

Chip assembly and interconnections for soft electronic platform

Gradient index structures for sub-THz lens-antenna applications

Semiconductor Device Modeling for Analog AI Accelerator

The project has the following objectives:

MIELi Steering group: